Scheinbar haben Sie Javascript in Ihrem Browser deaktiviert. Einige Funktionen auf dieser Seite funktionieren nur, wenn Sie sich anmelden.

Wird ein Fehler angezeigt?

HDF-V15-113L011

Name: NorComp HDF-V15-113L011
Brand: NorComp
SKU: 636-HDF-V15-113L011
Price: 9.63 EUR
Availability: InStock

Bilder dienen lediglich der Veranschaulichung und sind nicht Originalgetreu
Siehe Produktspezifikationen

Mouser-Nr.:

636-HDF-V15-113L011

Herst.- Nr.:

HDF-V15-113L011

Herst.:

NorComp

Beschreibung:

D-Sub-Steckverbinder mit hoher Dichte 15 pin vert solder M flash 4-40 int thrd

Datenblatt:

HDF-V15-113L011 Datenblatt (PDF)

ECAD Model:

Den kostenlosen Library Loader herunterladen, um diese Datei für Ihr ECAD Tool zu konvertieren. Weitere Infos zu ECAD-Modell.

Mehr über

Weitere Informationen zu NorComp HDF-V15-113L011

Auf Lager: 33

Lagerbestand:: 33 sofort lieferbar

Ein unerwarteter Fehler ist aufgetreten. Bitte versuchen Sie es später noch einmal.
Lieferzeit ab Hersteller:: 2 Wochen Geschätzte Produktionszeit des Werks für Mengen, die größer als angezeigt sind.

Menge eingeben:

Minimum: 1 Vielfache: 1

Stückpreis:

€ -,--

Erw. Preis:

€ -,--

Vorauss. Zolltarif:

Preis (EUR)

Menge	Stückpreis	Erw. Preis
	€ 9,63	€ 9,63
	€ 8,19	€ 81,90
	€ 7,19	€ 359,50
	€ 6,84	€ 684,00
	€ 6,51	€ 1.640,52
	€ 6,20	€ 3.124,80
	€ 5,94	€ 5.987,52

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Produktattribut	Attributwert	Attribut auswählen
Hersteller:	NorComp
Produktkategorie:	D-Sub-Steckverbinder mit hoher Dichte
RoHS:
REACH - SVHC:
Anzahl der Positionen:	15 Position
Anzahl der Zeilen:	3 Row
Anschlussart:	Male
Montage:	Solder Tail
Montagewinkel:	Straight
Kontaktüberzug:	Gold
Nennstrom:	3 A
Serie:	HDF
IP-Schutzklassen:	IP67
Verpackung:	Tray
Marke:	NorComp
Kontaktmaterial:	Brass
Land der Bestückung:	Not Available
Land der Verbreitung:	Not Available
Ursprungsland:	TW
Gefiltert:	Unfiltered
Isolierung:	Insulated
Isoliermaterial:	Polybutylene Terephthalate (PBT)
Maximale Betriebstemperatur:	+ 85 C
Minimale Betriebstemperatur:	- 25 C
Montageart:	Panel
Produkt-Typ:	High Density D-Sub Connectors
Gehäusematerial:	Steel
Gehäusebeschichtung:	Tin
Verpackung ab Werk:	63
Unterkategorie:	D-Sub Connectors
Handelsname:	NANOOK

Produkte gefunden:

Um ähnliche Produkte anzuzeigen, wählen Sie mindestens ein Kontrollkästchen aus

Um ähnliche Produkte in dieser Kategorie anzuzeigen, wählen Sie mindestens ein Kontrollkästchen oben aus.

Ausgewählte Attribute: 0

Dokument filtern:

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

NANOOK IP67 HDF High-Density D-Sub Connectors

NorComp NANOOK HDF High-Density D-Sub Connectors are offered in 15 to 62 positions with a contact rating of 3A. These IP67, flanged, waterproof connectors provide an all-inclusive solution for a wide range of applications. The D-sub connectors are available in solder cup, vertical solder tail, and right-angle solder tail contact terminations. Typical applications for NorComp NANOOK HDF High-Density D-Sub Connectors include industrial control systems, telecommunication equipment, and computer technology.

Industrial Automation Solutions

NorComp Industrial Automation Solutions feature connectors designed for industrial robotic devices. These highly complex electromechanical machines may contain multiple computers and motors, dozens of sensors, hydraulic pumps, and connections to a network. There is also a growing need for reduced size, weight, and power consumption, along with increased connector throughput. NorComp has engineered connectors to meet the challenging demands of robotic systems used in industrial automation.

NANOOK IP67 D-Sub Connectors

NorComp NANOOK IP67 D-Sub Connectors provide an all-inclusive solution for a wide range of applications. The connectors are available in standard, high-density, and mixed-layout styles. These cost-effective connectors are reliable and easy to install. Typical applications for NorComp NANOOK IP67 D-Sub Connectors include telecommunication equipment, industrial control systems, and computer technology.

High Density D-Sub Connectors

NorComp High Density D-Sub Connectors are available in cable and board mount options. Cable mount options include crimp and solder cup and the board mount options include Dip Solder, Wire Wrap, High Profile, Right Angle, & Surface Mount (SMT). This comprehensive NorComp High Density Density D-Sub product offering is available in both stamped & formed and machined contact options.

D-Sub Solutions

NorComp D-Sub Solutions offer a broad range of higher reliability D-Sub connectors, backshells, and hoods. NorComp's D-Sub product line is designed for applications that require a rugged, robust I/O connector system with various styles and mounting options. All are used in multiple industries, including computer, industrial, medical, and military markets.

Telematic Connector Solutions

NorComp Telematic Connectors offer exceptional reliability and superior protection against moisture with an IP67 rating. These connectors are designed to withstand high-vibration environments, ensuring optimal performance. Suitable applications include emergency warning systems, GPS navigation, vehicle tracking, and fleet management devices. NorComp Telematic Connectors provide a secure and reliable connection that is essential for the precise reporting of telematics technology.

Rugged Environment Certified (REC) Connectors

NorComp Rugged Environment Certified (REC) Connectors are ruggedized harsh-environment connector solutions that have been proven to withstand the most challenging environments. Rugged Environment Certified (REC) is an external testing certification certifying quality and performance. These connectors encompass D-sub and circular connectors that are available in standard, high-density, or mixed layout types. These connectors are reliable, cost-effective, provide ease of installation, and are ideal for use in many outdoor harsh environments including oil rigs, weather stations, and ruggedized industrial applications.