Samtec SEAF8-RA Serie Platine-zu-Platine & Mezzanine-Steckverbinder

Ergebnisse: 16
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Nennstrom Nennspannung Maximale Datenrate Minimale Betriebstemperatur Maximale Betriebstemperatur Kontaktüberzug Kontaktmaterial Gehäusematerial Serie Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 128Auf Lager
75Auf Bestellung
Min.: 1
Mult.: 1
: 75

Connectors 500 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 63Auf Lager
Min.: 1
Mult.: 1
: 75

Connectors 300 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 100Auf Lager
Min.: 1
Mult.: 1
: 100

Connectors 320 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 88Auf Lager
100Auf Bestellung
Min.: 1
Mult.: 1
: 100

Connectors 160 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 14Auf Lager
Min.: 1
Mult.: 1
: 100

Connectors 240 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 16Auf Lager
Min.: 1
Mult.: 1
: 100

Connectors 320 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 125Auf Lager
Min.: 1
Mult.: 1
: 75

Connectors 400 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket 15Auf Lager
Min.: 1
Mult.: 1
: 75

Connectors 500 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Min.: 1
Mult.: 1
: 100

Connectors 240 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1
: 100

Connectors 160 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 75
Mult.: 75
: 75

Connectors 200 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 75
Mult.: 75
: 75

Connectors 300 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 100
Mult.: 100
: 100

Connectors 400 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 100
Mult.: 100
: 100

Connectors 400 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1
Mult.: 1
: 75

Connectors 200 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 22 Wochen
Min.: 75
Mult.: 75
: 75

Connectors 400 Position 0.8 mm (0.031 in) 10 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel