|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
€ 10,66
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM40015L042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
€ 11,20
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40015S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
€ 11,20
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM40015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
€ 19,88
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM50010S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
€ 19,88
-
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
Mouser-Teilenr.
200-LPAM50010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
€ 22,58
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM50015S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.0-S-04-1-K-TR
- Samtec
-
700:
€ 4,83
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAF10030S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 700
Mult.: 700
:
700
|
|
|
Sockets
|
40 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-S-04-2-K-TR
- Samtec
-
650:
€ 4,94
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF10035S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 650
Mult.: 650
:
650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-06-1-K-TR
- Samtec
-
550:
€ 6,49
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF20030L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-08-2-K-TR
- Samtec
-
325:
€ 10,35
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF20035S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-S-06-2-K-TR
- Samtec
-
550:
€ 8,10
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF30030S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-06-2-K-TR
- Samtec
-
500:
€ 10,02
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF40035L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-08-1-K-TR
- Samtec
-
325:
€ 14,92
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF40035L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-1-K-TR
- Samtec
-
500:
€ 8,87
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF40035S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
€ 12,13
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM10010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
€ 12,13
|
|
|
€ 11,60
|
|
|
€ 11,16
|
|
|
€ 10,35
|
|
|
€ 7,56
|
|
|
Anzeigen
|
|
|
€ 8,88
|
|
|
€ 7,56
|
|
|
€ 7,37
|
|
Min.: 1
Mult.: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
400:
€ 7,33
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM10010S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
300:
€ 10,44
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM20010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
€ 10,98
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM20010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
1:
€ 17,11
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM20015L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
€ 17,11
|
|
|
€ 16,36
|
|
|
€ 15,74
|
|
|
€ 14,59
|
|
|
€ 10,66
|
|
|
Anzeigen
|
|
|
€ 12,53
|
|
|
€ 10,40
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
€ 9,74
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM30010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
€ 15,95
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM30015L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
€ 15,95
|
|
|
€ 15,26
|
|
|
€ 14,68
|
|
|
€ 13,61
|
|
|
€ 9,95
|
|
|
Anzeigen
|
|
|
€ 11,69
|
|
|
€ 9,70
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
€ 16,18
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM40015L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-04-1-K-TR
- Samtec
-
650:
€ 4,70
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAF1003.5L041K
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 650
Mult.: 650
:
650
|
Nein
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-08-1-K-TR
- Samtec
-
350:
€ 9,66
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAF2003.0L081K
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 350
Mult.: 350
:
350
|
Nein
|
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LPAF
|
Reel
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Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-1-K-TR
- Samtec
-
300:
€ 10,44
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-LPAM2001.0L081K
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
Nein
|
|
|
|
|
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LPAM
|
Reel
|
|
Österreich