Multiprotokoll-Module

Ergebnisse: 1 403
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Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Qualifikation
Verpackung
Quectel Multiprotocol Modules Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1
Datenblatt

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel Multiprotocol Modules
Datenblatt

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 33 dBm ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SD Card, SPI, UART, USB 2.0, Video 3.55 V 4.4 V - 35 C + 65 C Pad 44 mm x 43 mm x 2.85 mm Bluetooth 4.2 LTE Cat 6 GNSS
Espressif Systems Multiprotocol Modules SMD module, ESP32-S3, 4 MB SPI flash, PCB antenna
Datenblatt

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotocol Modules "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Intel Multiprotocol Modules Intel Wireless-AC 9260, 2230, 2x2 AC+BT, Gigabit, No vPro
Datenblatt

Wireless-AC 9260 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.1 802.11 ac

Intel Multiprotocol Modules Intel Dual Band Wireless-AC 9260 Industrial IoT Kit, No vPro, Extended temp
Datenblatt

2.4 GHz, 5 GHz PCIe, USB - 40 C + 85 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.1 802.11 ac
Silicon Labs Multiprotocol Modules MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
Datenblatt

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
CEL Multiprotocol Modules Wi-Fi 6 BT/BLE5.2 SDIO I-Temp PCB Antenna
Datenblatt

CMP961X 2.4 GHz, 5 GHz SPI, UART Bluetooth Bulk
CEL Multiprotocol Modules Wi-Fi 6 BT/BLE5.2 802.15.4 SDIO I-Temp PCB Antenna
Datenblatt

CMP961X 2.4 GHz, 5 GHz SPI, UART Bluetooth Bulk
RF Solutions ESP32-C3-12F
RF Solutions Multiprotocol Modules
Datenblatt
InnoPhase IoT Multiprotocol Modules WiFi/BLE5/MCU Module w/ RF Antenna Pin Reduced Footprint
Datenblatt

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C RF 12.8 mm x 15 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
InnoPhase IoT Multiprotocol Modules WiFi/BLE5/MCU Module w/ U.FL Antenna Connector
Datenblatt
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 12.8 mm x 17 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Quectel Multiprotocol Modules Longevity till 2025. Recommended to push SC682A for new designs
Datenblatt

33 dBm ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SD Card, SPI, UART, USB 2.0, Video 3.55 V 4.4 V - 35 C + 65 C Pad 44 mm x 43 mm x 2.85 mm Bluetooth 4.2 LTE Cat 6 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, North America, mPCIe form factor
Datenblatt

700 MHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules CAT 4
Datenblatt

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, Japan only, mPCIe form factor
Datenblatt

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C Patch 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Jorjin Multiprotocol Modules Based on TI WL1831 and supports 802.11b/g/n & BT/BLE 4.2
Datenblatt

2.4 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 75 C 12.8 mm x 12 mm x 1.7 mm Bluetooth 802.11 b/g/n Reel, Cut Tape, MouseReel
Espressif Systems Multiprotocol Modules SMD module, ESP32-S3, 4 MB SPI flash, IPEX antenna connector
Datenblatt

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
u-blox Multiprotocol Modules M.2 card with JODY-W377, in tray
Datenblatt

JODY-W3 2.4 GHz, 5 GHz 19 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.3 Tray
Nordic Semiconductor Multiprotocol Modules Lower Power SIP for cellular IoT and DECT NR+
Datenblatt

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Nordic Semiconductor Multiprotocol Modules Lower Power SIP for cellular IoT and DECT NR+
Datenblatt

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Fanstel Multiprotocol Modules Low cost nRF52833 BLE 5.4 module, 512KB flash,128KB RAM, PCB antenna
Datenblatt

2.4 GHz 8.73 dBm I2C, SPI, UART 1.7 V 5.5 V - 40 C + 105 C PCB 10 mm x 14.3 mm x 1.9 mm Bluetooth 5.2 Thread, Zigbee Reel, Cut Tape
Espressif Systems Multiprotocol Modules SMD module, ESP32-C3FH4X, Chip Revision v1.1 or above, PCB antenna, -40 C +85 C
Datenblatt

Advantech Multiprotocol Modules 5G Sub6+GNSS M.2 3052 Key B, USB only sku
Datenblatt

AIW-357 USB 3.1 V 3.63 V - 30 C + 70 C 30 mm x 52 mm x 2.4 mm BeiDou, Galileo, GLONASS, GNSS, GPS, LTE, QZSS, WCDMA